Joseph Hoh Email and Phone Number
Mechanical Engineer
at
Dymenso
Joseph Hoh's email is jhoh137@gmail.com
.
Joseph Hoh Contact Details
Email
jhoh137@gmail.com
Email
joseph.hoh@sjsu.edu
Email
jhoh@salesian.com
Email
jhoh@dymenso.com
Joseph Hoh Company Details
Company
Location
California, United States
Website
Industry
Mechanical Or Industrial Engineering
Joseph Hoh's Current Company
Dymenso
Industry | Mechanical Or Industrial Engineering | |
Location | California, United States |
Industry | Mechanical Or Industrial Engineering | |
Location | California, United States |
Joseph Hoh's Experience and Education
Assistant Volleyball Coach
2015-02-01 to 2009-05
Richmond, California, United States
Masters in Mechanical Engineering
2013 to 2016
San Jose, California, United States
Bachelor Of Science in Mechanical Engineering
2006 to 2010
Berkeley, California, United States
Frequently Asked Questions about Joseph Hoh
What company does Joseph Hoh work for?
Joseph Hoh works for Dymenso
What is Joseph Hoh's role in his workplace?
Joseph Hoh's role in his workplace is
Mechanical Engineer .
Which industry does Joseph Hoh work in currently?
Joseph Hoh works in the industry
Mechanical Or Industrial Engineering.
What is Joseph Hoh's email address?
Joseph Hoh's email address is jhoh137@gmail.com
What schools did Joseph Hoh attended?
Joseph Hoh attended
San Jose State University,
and
University Of California, Berkeley.
What are some of Joseph Hoh's interests?
Joseph Hoh has interests in
Science And Technology,
and
Education.
What are some of Joseph Hoh's skills?
Joseph Hoh has skills like
Solidworks,
Pro Engineer,
Microsoft Word,
Microsoft Excel,
Matlab,
Arduino,
Labview,
Ansys,
3d Studio Max,
Cad,
Finite Element Analysis,
Product Design,
Mechanical Engineering,
and
Ptc Creo.
Who are Joseph Hoh's colleagues?
Joseph Hoh's colleagues are
Philipp Borchard,
and
Philipp Borchard.
Who are Joseph Hoh's peers at other companies?
Joseph Hoh's peers at other companies are
Jordi Montal,
Jobish Paul,
Nitin Pokale,
Carl Glass,
Alperen Yavuz,
Achmad Riyadi,
and
Balamurali A.